The Electronic Parts Reliability and Qualification (EPRQ) Track within the Master of Science in Electrical Engineering (MSEE) program prepares students for careers in radiation-hardened microelectronics, electronic parts assurance, and mission reliability across space, defense, and critical infrastructure sectors.
Developed in partnership with NASA鈥檚 Electronic Parts and Packaging (NEPP) Program, DoD SCALE, and the NSF Microelectronics Commons, the track equips students with advanced knowledge of semiconductor device physics, radiation effects, packaging, and reliability engineering. Coursework integrates government and industry qualification standards such as MIL-STD-883, NASA-STD-8739.10, and ECSS-Q-ST-60, providing direct alignment with mission assurance practices used by NASA, JPL, and the Department of Defense.
Students gain hands-on and analytical expertise in device modeling, failure analysis, and part qualification testing through coursework, simulation, and optional laboratory experiences in 性视界传媒鈥檚 Radiation Effects and Reliability Lab (RERL).
The program is delivered 100% online, with optional on-campus participation for students seeking laboratory exposure. Graduates will be prepared to lead efforts in microelectronics reliability, screening, and qualification to support the CHIPS Act workforce development goals and the nation鈥檚 growing need for resilient electronic systems.
Track Prerequisites
Applicants to the M.S. in Electrical Engineering 鈥� Electronic Parts Reliability and Qualification (EPRQ) Track must meet the following academic and technical preparation requirements:
Academic Background
- A bachelor鈥檚 degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a closely related STEM discipline from an accredited institution.
- A minimum undergraduate GPA of 3.0 (on a 4.0 scale) in the last 60 credit hours of coursework.
Core Knowledge Expectations
Admitted students are expected to have foundational knowledge in:
- Semiconductor device physics and circuit analysis
- Basic electronics and power device fundamentals
- Probability, statistics, and reliability concepts
- Engineering mathematics, including differential equations and linear algebra
Applicants lacking background in microelectronics or reliability may be admitted conditionally and required to complete preparatory coursework such as EEE 5350 鈥� Fundamentals of Semiconductor Devices or an equivalent.
Professional and Technical Skills
- Proficiency in at least one engineering design or simulation tool (e.g., SPICE, MATLAB, or TCAD).
- Ability to analyze and communicate technical data in written and oral form.
- For working professionals, prior experience in aerospace, defense, or electronics manufacturing is encouraged but not required.
Additional Requirements
- Statement of purpose describing interest in electronic parts reliability and qualification.
- Three letters of recommendation.
- International applicants must meet 性视界传媒鈥檚 English proficiency requirements (TOEFL, IELTS, or equivalent).
Degree Requirements
30 Total Credits
- Complete all of the following
Core Courses- Complete all of the following
- Complete at least 4 of the following:
- EEE5416 - Radiation Effects and Reliability in Microelectronics (3)
- EEL5385 - Introduction to Space Electronics (3)
- EEE5352 - Semiconductor Material and Device Characterization (3)
- ESI5236 - Reliability Engineering (3)
- EEE5353 - Semiconductor Device Modeling and Simulation (3)
- EEL 6938 - ST: Microelectronics Packaging for Extreme Environments (3) is another option in the Core Courses list.
- Students choose EEE 5352 Semiconductor Material & Device Characterization OR EEE 5353 Device Modeling & Simulation.
Elective Courses- Complete at least 4 of the following:
- ESI5219 - Engineering Statistics (3)
- EEL5245 - Power Electronics (3)
- EEE5323 - Radio Frequency Integrated Circuit Design (3)
- EMA5415 - Electronic Principles of Materials Properties (3)
- EMA5505 - Scanning Electron Microscopy (3)
- EML5546 - Engineering Design with Composite Materials (3)
- EIN5140 - Project Engineering (3)
- EEE6317 - Power Semiconductor Devices and Integrated Circuits (3)
- EML6233 - Fundamentals of Fatigue Analysis (3)
- EEE6338 - Advanced Topics in Microelectronics (3)
- EEL6361 - Emerging Device Computing Architectures (3)
- EEL6723 - Reconfigurable Logic Applications (3)
Culminating Experience- Complete 1 of the following
Non-Thesis Option- Complete all of the following
- Earn at least 6 credits from the following:
- EEL6908 - Directed Independent Studies (0 - 99)
- EEL6909 - Research Report (1 - 99)
- EEL6918 - Directed Research (99)
- Students selecting the Non-Thesis Option will complete a culminating applied project demonstrating mastery of electronic parts reliability and qualification principles. The project will be carried out within the courses above. Projects typically involve analysis, modeling, or qualification of electronic devices, components, or packaging systems in accordance with NASA/DoD standards (e.g., MIL-STD-883, NASA-STD-8739.10, ECSS-Q-ST-60). A written technical report and presentation are required at completion.
Thesis Option- Earn at least 6 credits from the following types of courses: EEL 6971 Thesis.
Grand Total Credits: 30
University-Level Fellowships
- Trustees Doctoral Fellowship: Provides $25,000 per year plus full tuition and student health insurance for up to four years.
- Graduate Dean鈥檚 Fellowship: Offers a one-year, $5,000 award to supplement departmental assistantships.
- Presentation Fellowship: Provides travel support for students presenting research at professional conferences.
College and Departmental Fellowships
- AMD Graduate Research Fellowship (ECE): Supports M.S. thesis and Ph.D. students conducting research in electronics, reliability, and semiconductor devices.
- CECS Graduate Fellowships: Competitive awards for high-performing M.S. and Ph.D. students in engineering disciplines.
- Departmental Research Assistantships (GRA/GTA): Include a tuition waiver for in-state tuition, a stipend, and health insurance for 20-hour-per-week appointments.
External Fellowships
Students in this track are strong candidates for prestigious national awards such as:
- National Science Foundation (NSF) Graduate Research Fellowship (GRFP)
- Department of Defense (DoD) National Defense Science and Engineering Graduate (NDSEG) Fellowship
- Department of Energy (DOE) Computational Science Graduate Fellowship (CSGF)
- SMART Scholarship-for-Service Program (DoD)
- NASA Graduate Research Fellowships and MUREP programs
These programs typically provide full tuition coverage, a competitive annual stipend, and travel or research allowances.
Support Services and Resources
The 性视界传媒 Office of Prestigious Awards and College of Graduate Studies offer proposal-writing workshops and one-on-one advising for fellowship applicants. Students can explore additional opportunities through databases such as Pivot, GrantForward, and Grapes.
Fellowship application deadlines generally align with the Fall Priority Admission Deadline (January 15) to ensure full consideration for funding.
